US Patent 10181455 3D thin profile pre-stacking architecture using reconstitution method
Patent 10181455 was granted and assigned to Apple (company) on January, 2019 by the United States Patent and Trademark Office.
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Patent abstract
Package on package structures and methods of manufacture are described. In various embodiments, DRAM die are integrated into various locations within a package on package structure, including within a bottom logic die package, as a co-package with a top NAND die package, and as a hybrid package structure between a top NAND die package and a bottom logic die package.
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Patent Inventor Names
Chonghua Zhong0
Jun Zhai0
Kunzhong Hu0
Se Young Yang0
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Patent Citations Received
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
101814550
Date of Patent
January 15, 2019
0Patent Application Number
154082630
Date Filed
January 17, 2017
0Patent Primary Examiner
Edits on 24 Jan, 2022
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US Patent 10181455 3D thin profile pre-stacking architecture using reconstitution method
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10181455
Date of patent
January 15, 2019
Patent application number
15408263
Date Filed
January 17, 2017
Patent primary examiner
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