Patent 10185085 was granted and assigned to Huawei Technologies Co., Ltd. on January, 2019 by the United States Patent and Trademark Office.
An on-chip optical interconnection structure and network, where the on-chip optical interconnection structure includes M levels of optical switches, and mth-level optical switches in the M levels of optical switching devices include 2m-1 optical switches. Each optical switch in (i-1)th-level optical switches in the M levels of optical switches is coupled to two optical switches in ith-level optical switches. Two optical switches in the ith-level optical switches coupled to a same optical switch in the (i-1)th-level optical switches are coupled. The on-chip optical interconnection network is divided into levels, and switches coupled in a grid manner are formed such that hierarchical switching may be performed, and conflicts and delays in communication are reduced.