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US Patent 12136617 Electrical bridge package with integrated off-bridge photonic channel interface

Patent 12136617 was granted and assigned to Celestial AI on November, 2024 by the United States Patent and Trademark Office.

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Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Ankur Aggarwal0

Date of Patent

November 5, 2024

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Patent Application Number

184074080

Date Filed

January 8, 2024

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Patent Citations

US Patent 8064739 Three-dimensional die stacks with inter-device and intra-device optical interconnect

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US Patent 8213751 Electronic-integration compatible photonic integrated circuit and method for fabricating electronic-integration compatible photonic integrated circuit

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US Patent 8260147 System-on-chip having optical interconnections

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US Patent 7034641 Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body

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US Patent 7778501 Integrated circuits having photonic interconnect layers and methods for fabricating same

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US Patent 7889996 Optical-signal-path routing in a multi-chip system

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US Patent 7894699 Photonic based interconnects for interconnecting multiple integrated circuits

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US Patent 7961990 Multi-chip system including capacitively coupled and optical communication

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Patent abstract

A method of manufacturing a circuit package is described that includes connecting a photonic interposer and a second interposer, connecting a die to both the photonic interposer and the second interposer, where the die partially overlaps both the photonic interposer and the second interposer, and connecting an optical element to the photonic interposer.

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