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US Patent 12136617 Electrical bridge package with integrated off-bridge photonic channel interface

Patent 12136617 was granted and assigned to Celestial AI on November, 2024 by the United States Patent and Trademark Office.

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 US Patent 12136617 Electrical bridge package with integrated off-bridge photonic channel interface

Article

Patent abstract

A method of manufacturing a circuit package is described that includes connecting a photonic interposer and a second interposer, connecting a die to both the photonic interposer and the second interposer, where the die partially overlaps both the photonic interposer and the second interposer, and connecting an optical element to the photonic interposer.

Infobox
Is a
Patent
Patent
0
Patent Applicant
Celestial AI
Celestial AI
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Current Assignee
Celestial AI
Celestial AI
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
121366170
Patent Inventor Names
Ankur Aggarwal0
Date of Patent
November 5, 2024
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Patent Application Number
184074080
Date Filed
January 8, 2024
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Patent Citations
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US Patent 11107770 Integrated electrical/optical interface with two-tiered packaging
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US Patent 11165509 Method for co-packaging light engine chiplets on switch substrate
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US Patent 11165711 Methods and apparatuses for transparent embedding of photonic switching into electronic chassis for scaling data center cloud system
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US Patent 7778501 Integrated circuits having photonic interconnect layers and methods for fabricating same
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US Patent 7889996 Optical-signal-path routing in a multi-chip system
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US Patent 7894699 Photonic based interconnects for interconnecting multiple integrated circuits
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US Patent 7961990 Multi-chip system including capacitively coupled and optical communication
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US Patent 8064739 Three-dimensional die stacks with inter-device and intra-device optical interconnect
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US Patent 8213751 Electronic-integration compatible photonic integrated circuit and method for fabricating electronic-integration compatible photonic integrated circuit
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US Patent 8260147 System-on-chip having optical interconnections
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US Patent 8285140 Shared-source-row optical data channel organization for a switched arbitrated on-chip optical network
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US Patent 8326148 Optical network
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US Patent 8340517 Systems and methods for on-chip data communication
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US Patent 8447146 Photonic interconnect method
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US Patent 8611747 Method and system for multiplexing optical communication signals
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US Patent 9036482 Bufferless nonblocking networks on chip
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US Patent 9369784 Optical arbitration device and method in a network-on-chip system
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US Patent 9495295 Photonics-optimized processor system
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US Patent 9831360 Integrated thermal stabilization of a microring resonator
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US Patent 9882655 Optical network-on-chip, method for dynamically adjusting optical link bandwidth
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US Patent 10031287 Waveguide architecture for photonic neural component with multiplexed optical signals on inter-node waveguides
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US Patent 10107959 Waveguide architecture for photonic neural component
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US Patent 10117007 Routing node, optical switching network, and optical signal transmission method
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US Patent 10185085 On-chip optical interconnection structure and network
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US Patent 10225632 Planar photonic switch fabrics with reduced waveguide crossings
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US Patent 10250958 Optical network-on-chip, optical router, and signal transmission method
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US Patent 10281747 Applications of wavelength-locking using dithering signals for microring resonators
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US Patent 11233580 Pooled DRAM system enabled by monolithic in-package optical I/O
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US Patent 10365445 Optical modules integrated into an IC package of a network switch having electrical connections extend on different planes
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US Patent 10564512 Hybrid photonic non-blocking wide spectrum WDM on-chip router
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US Patent 10598852 Digital-to-analog converter (DAC)-based driver for optical modulators
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US Patent 10651933 Thermal calibration of a ring modulator
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US Patent 10837827 System and method for photonic analog-to-digital conversion
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US Patent 10908369 Flexible onboard optics for networking switches
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US Patent 10935722 CMOS compatible material platform for photonic integrated circuits
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US Patent 10951325 Use of siilicon photonics (SiP) for computer network interfaces
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US Patent 10962728 Co-packaged optics and transceiver
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US Patent 10976491 Photonics interposer optoelectronics
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US Patent 11336376 Flexible switch solution based on co-packaged optics
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
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US Patent 11500153 Multi-chip packaging of silicon photonics
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US Patent 11509397 Balanced photonic architectures for matrix computations
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US Patent 11769710 Heterogeneous integration module comprising thermal management apparatus
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US Patent 7034641 Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body
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Patent Primary Examiner
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Jaehwan Oh
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CPC Code
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H01L 25/167
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H01L 25/0652
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H01L 23/5384
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G02B 6/4292
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G02B 6/4202
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H01L 21/56
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