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US Patent 10192858 Light emitting structure

Patent 10192858 was granted and assigned to Apple (company) on January, 2019 by the United States Patent and Trademark Office.

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Patent abstract

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

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