Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2019
Patent Application Number
15144162
Date Filed
May 2, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
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