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US Patent 10748856 Fan-out semiconductor package

Patent 10748856 was granted and assigned to Samsung on August, 2020 by the United States Patent and Trademark Office.

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Is a

Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

August 18, 2020

Patent Application Number

16103199

Date Filed

August 14, 2018

Patent Citations

US Patent 10199337 Electronic component package and method of manufacturing the same

US Patent 10283443 Chip package having integrated capacitor

US Patent 10325891 Fan-out semiconductor package and package on package including the same

US Patent 10340153 Fan-out semiconductor package and method of manufacturing same

0

US Patent 10388614 Fan-out semiconductor package and method of manufacturing same

US Patent 10347585 Fan-out semiconductor package

US Patent 10037963 Package structure and method of forming the same

US Patent 10043772 Fan-out semiconductor package

0

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Patent Citations Received

US Patent 11765833 Substrate having electric component embedded therein

Patent Primary Examiner

Mohammed Shamsuzzaman

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