Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 7, 2019
Patent Application Number
15474700
Date Filed
March 30, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a plurality of redistribution layers, a dielectric layer, and a conductive structure. The redistribution layers are formed overlying a device die to provide an electrical connection between the device die and an external connector in a package. The dielectric layer is arranged between the redistribution layers to form a capacitor structure. The conductive structure is formed and coupled between the device die and the redistribution layers.
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