Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Shiang Liao0
Huan-Neng Chen0
Date of Patent
May 16, 2023
0Patent Application Number
171352860
Date Filed
December 28, 2020
0Patent Citations
Patent Primary Examiner
A semiconductor arrangement is provided. The semiconductor arrangement includes a molding layer and a first capacitor. The first capacitor includes a first vertical conductive structure within the molding layer, a second vertical conductive structure within the molding layer, and a first high-k dielectric material between the first vertical conductive structure and the second vertical conductive structure.
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