US Patent 11652136 Semiconductor arrangement
Patent 11652136 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2023 by the United States Patent and Trademark Office.
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Edits on 14 Aug, 2023
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Patent Inventor Names
Huan-Neng Chen0
Wen-Shiang Liao0
Edits on 17 May, 2023
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Article (+409 characters)
US Patent 11652136 Semiconductor arrangement
Article
A semiconductor arrangement is provided. The semiconductor arrangement includes a molding layer and a first capacitor. The first capacitor includes a first vertical conductive structure within the molding layer, a second vertical conductive structure within the molding layer, and a first high-k dielectric material between the first vertical conductive structure and the second vertical conductive structure.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116521360
Date of Patent
May 16, 2023
0Patent Application Number
171352860
Date Filed
December 28, 2020
0Patent Citations
Patent Primary Examiner
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