Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seung Eun Lee
Yong Hoon Kim
Myeong Hui Jung
Date of Patent
September 19, 2023
Patent Application Number
17681093
Date Filed
February 25, 2022
Patent Citations
Patent Primary Examiner
Patent abstract
A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.
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