Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 12, 2019
Patent Application Number
15616914
Date Filed
June 7, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process chamber. The heat source is in the process chamber. The movable device contacts the heat source, in which the movable device is movable with respect to the wafer support.
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