US Patent 10204807 Apparatus and method for processing wafer
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Patent abstract
An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process chamber. The heat source is in the process chamber. The movable device contacts the heat source, in which the movable device is movable with respect to the wafer support.
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Patent Citations Received
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Patent Jurisdiction
Patent Number
102048070
Date of Patent
February 12, 2019
0Patent Application Number
156169140
Date Filed
June 7, 2017
0Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
102048070
Date of Patent
February 12, 2019
0Patent Application Number
156169140
Date Filed
June 7, 2017
0Patent Primary Examiner
Edits on 24 Jan, 2022
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US Patent 10204807 Apparatus and method for processing wafer
Infobox
Is a
Patent jurisdiction
Patent number
10204807
Date of patent
February 12, 2019
Patent application number
15616914
Date Filed
June 7, 2017
Patent primary examiner
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