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US Patent 10204883 Semiconductor device and manufacturing method thereof
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Patent
Date Filed
February 2, 2016
Date of Patent
February 12, 2019
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Patent Application Number
15013700
Patent Citations Received
US Patent 10566261 Integrated fan-out packages with embedded heat dissipation structure
0
US Patent 10978370 Integrated fan-out packages with embedded heat dissipation structure
US Patent 10504815 Integrated fan-out packages with embedded heat dissipation structure
Patent Inventor Names
Jie Chen
0
Hsien-Wei Chen
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10204883
Patent Primary Examiner
Andres Munoz
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