Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sung Jae Yoon0
Seong Jong Cheon0
Date of Patent
February 26, 2019
Patent Application Number
15789070
Date Filed
October 20, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of the substrate, a sealing member sealing the electronic component, and a shielding member surrounding the first electronic component and disposed in the sealing member.
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