US Patent 10879192 Semiconductor structure and manufacturing method thereof

Patent 10879192 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2020 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10879192

Date of Patent

December 29, 2020

Patent Application Number

16514987

Date Filed

July 17, 2019

Patent Citations

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US Patent 10217711 Semiconductor package and manufacturing method thereof

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US Patent 10629519 Semiconductor device package and method of manufacturing the same

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US Patent 10134683 Semiconductor device package and method of manufacturing the same

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US Patent 10559513 Circuit board and packaged chip

Patent Primary Examiner

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David A Zarneke

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