Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
You-Wei Lin0
Date of Patent
February 11, 2020
0Patent Application Number
158503760
Date Filed
December 21, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A circuit board includes an upper circuit and a lower surface that are opposite to each other, a plurality of heat sink bonding pads, and a plurality of heat sink conductive pads. The heat sink bonding pads are disposed on the upper surface and electrically insulated from one another, and are used to electrically connect to a heat sink. The heat sink conductive pads are disposed on the lower surface, electrically insulated from one another, and electrically connected to the heat sink bonding pads, respectively.
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