Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu-Sheng Hung0
Ta-Jen Yu0
Wen-Sung Hsu0
Date of Patent
February 26, 2019
Patent Application Number
15638388
Date Filed
June 30, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.
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