Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark Gerber0
Date of Patent
January 2, 2024
0Patent Application Number
169374930
Date Filed
July 23, 2020
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor package structure and a method of manufacturing the semiconductor package structure are disclosed. The semiconductor package structure includes a first semiconductor device having an active surface, a redistribution structure in electrical connection with the first semiconductor device, and a second semiconductor device bonded to the active surface of the first semiconductor device, and disposed between the first semiconductor device and the redistribution structure.
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