US Patent 10221700 Systems and methods for bonding of dissimilar substrates

The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate may be coupled to a second substrate by a composite joint between the first substrate and the second substrate. The composite joint may be comprised of a first adhesive material and a second adhesive material. The first adhesive material may be disposed on the first substrate, and the second adhesive material may be disposed to the first adhesive material. The composite joint between the first substrate and the second substrate may provide an isolation layer therebetween, preventing galvanic corrosion.