Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 12, 2019
Patent Application Number
14098490
Date Filed
December 5, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.