Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pei-Ling Li0
Chia-Liang Chung0
Date of Patent
August 13, 2019
0Patent Application Number
155918550
Date Filed
May 10, 2017
0Patent Primary Examiner
Patent abstract
The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate having a first surface and a second surface opposite to the first surface and including a first conductive contact. The semiconductor package device further includes an electronic component disposed on the first surface of the substrate. The semiconductor package device further includes a metal frame disposed on the first surface of the substrate. The semiconductor package device further includes an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.