US Patent 10231364 Fluidly cooled power electronics assemblies having a thermo-electric generator

A power electronics assembly that includes a first cooling chip fluidly coupled to a second cooling chip. The first cooling chip and the second cooling chip each include a cooling chip fluid inlet, a cooling chip fluid outlet, and one or more cooling chip fluid channels extending between and fluidly coupled to the cooling chip fluid inlet and the cooling chip fluid outlet. The power electronics assembly also includes a semiconductor device positioned between and thermally coupled to the first cooling chip and the second cooling chip and a thermo-electric generator positioned between and thermally coupled to the semiconductor device and one of the first cooling chip or the second cooling chip.