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US Patent 11950394 Liquid-cooled assembly and method

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Richard Anthony Eddins0

Liang Yin0

Liqiang Yang0

David Richard Esler0

Brian Magann Rush0

Christopher James Kapusta0

Judd Everett Swanson0

Date of Patent

April 2, 2024

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Patent Application Number

174993240

Date Filed

October 12, 2021

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Patent Citations

US Patent 7477513 Dual sided board thermal management system

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US Patent 7697292 Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system

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US Patent 8208258 System and method for facilitating parallel cooling of liquid-cooled electronics racks

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US Patent 8358000 Double side cooled power module with power overlay

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US Patent 8653635 Power overlay structure with leadframe connections

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US Patent 9142484 Power module package

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US Patent 9337163 Low profile surface mount package with isolated tab

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US Patent 9391027 Embedded semiconductor device package and method of manufacturing thereof

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Patent Primary Examiner

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CPC Code

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Patent abstract

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

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