Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 22, 2013
Patent Application Number
12404272
Date Filed
March 13, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.
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