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US Patent 11950394 Liquid-cooled assembly and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 12, 2021
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Date of Patent
April 2, 2024
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Patent Application Number
17499324
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Patent Citations
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US Patent 7477513 Dual sided board thermal management system
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US Patent 7697292 Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system
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US Patent 8208258 System and method for facilitating parallel cooling of liquid-cooled electronics racks
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US Patent 8358000 Double side cooled power module with power overlay
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US Patent 8653635 Power overlay structure with leadframe connections
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US Patent 9142484 Power module package
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US Patent 9337163 Low profile surface mount package with isolated tab
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US Patent 9391027 Embedded semiconductor device package and method of manufacturing thereof
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US Patent 9437523 Two-sided jet impingement assemblies and power electronics modules comprising the same
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US Patent 9736967 Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus
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•••
Patent Inventor Names
Richard Anthony Eddins
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Liang Yin
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Liqiang Yang
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David Richard Esler
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Brian Magann Rush
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Christopher James Kapusta
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Judd Everett Swanson
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11950394
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Patent Primary Examiner
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Zachary Pape
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CPC Code
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H05K 7/20272
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H05K 7/20936
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H01L 23/4735
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H05K 7/20345
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H05K 7/20927
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H01L 23/4336
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