US Patent 11950394 Liquid-cooled assembly and method
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US Patent 11950394 Liquid-cooled assembly and method
Article
Patent abstract
The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.
Infobox
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Brian Magann Rush0
Christopher James Kapusta0
David Richard Esler0
Judd Everett Swanson0
Liang Yin0
Liqiang Yang0
Richard Anthony Eddins0
Date of Patent
April 2, 2024
0Patent Application Number
174993240
Date Filed
October 12, 2021
0Patent Citations
0
Patent Primary Examiner
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