Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Po-Chun Lin0
Date of Patent
April 9, 2019
0Patent Application Number
154248980
Date Filed
February 6, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
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