US Patent 10256179 Package structure and manufacturing method thereof
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Patent abstract
A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
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Patent Inventor Names
Po-Chun Lin0
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Patent Jurisdiction
Patent Number
102561790
Date of Patent
April 9, 2019
0Patent Application Number
154248980
Date Filed
February 6, 2017
0Patent Citations Received
Patent Primary Examiner
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US Patent 10256179 Package structure and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
10256179
Date of patent
April 9, 2019
Patent application number
15424898
Date Filed
February 6, 2017
Patent primary examiner
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