Patent attributes
A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.