Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Akihito Sawanobori
Date of Patent
October 31, 2023
Patent Application Number
17462981
Date Filed
August 31, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
According to one embodiment, a semiconductor device includes a substrate; a semiconductor chip provided on the substrate; a resin covering the semiconductor chip; and a metal film provided on the resin. The metal film includes a first metal layer provided on the resin, a second metal layer provided on the first metal layer, and a third metal layer provided on the second metal layer. The first metal layer and the second metal layer contain a same material, and a particle diameter of the second metal layer is smaller than a particle diameter of the first metal layer.
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