Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroyuki Yazawa0
Date of Patent
April 16, 2019
0Patent Application Number
154592550
Date Filed
March 15, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device according to the present embodiment includes a stacked body having an end which is step-shaped and a contact in each of the steps of the end. Each of the steps includes alternating a plurality of conductive layers and a plurality of insulating layers. The contact includes a plurality of conductive films contacting each of the conductive layers, and a plurality of insulating films contacting each of the insulating layers, the insulating films being provided between the conductive films.
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