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US Patent 10262963 Conductive barrier direct hybrid bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 6, 2018
Date of Patent
April 16, 2019
Patent Application Number
15947461
Patent Citations Received
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
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US Patent 11232983 Copper interconnect structure with manganese barrier layer
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US Patent 10770347 Interconnect structure
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US Patent 11569188 Semiconductor device including elongated bonding structure between the substrate
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US Patent 11296045 Semiconductor device and method of manufacturing the same
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US Patent 11804405 Method of forming copper interconnect structure with manganese barrier layer
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US Patent 11973045 Semiconductor structure and method for forming same
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10262963
Patent Primary Examiner
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Michelle Mandala

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