Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jeremy Alfred Theil0
Laura Wills Mirkarimi0
Guilian Gao0
Rajesh Katkar0
Cyprian Emeka Uzoh0
Date of Patent
October 29, 2024
0Patent Application Number
185391430
Date Filed
December 13, 2023
0Patent Citations
...
Patent Primary Examiner
Patent abstract
Devices and techniques including process steps make use of recesses in conductive interconnect structures to form reliable low temperature metallic bonds. A fill layer is deposited into the recesses prior to bonding. First conductive interconnect structures are bonded at ambient temperatures to second metallic interconnect structures using direct bonding techniques, with the fill layers in the recesses in one or both of the first and second interconnect structures.
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