Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Laura Wills Mirkarimi0
Liang Wang0
Rajesh Katkar0
Cyprian Emeka Uzoh0
Guilian Gao0
Jeremy Alfred Theil0
Date of Patent
November 29, 2022
0Patent Application Number
169959880
Date Filed
August 18, 2020
0Patent Citations
...
Patent Citations Received
Patent Primary Examiner
Devices and techniques including process steps make use of recesses in conductive interconnect structures to form reliable low temperature metallic bonds. A fill layer is deposited into the recesses prior to bonding. First conductive interconnect structures are bonded at ambient temperatures to second metallic interconnect structures using direct bonding techniques, with the fill layers in the recesses in one or both of the first and second interconnect structures.
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