Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Javier A. DeLaCruz0
Paul M. Enquist0
Rajesh Katkar0
Arkalgud R. Sitaram0
Liang Wang0
Date of Patent
December 31, 2019
0Patent Application Number
158493830
Date Filed
December 20, 2017
0Patent Citations
Patent Citations Received
0
0
0
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Patent Primary Examiner
Patent abstract
A bonded structure can include a first element having a first interface feature and a second element having a second interface feature. The first interface feature can be bonded to the second interface feature to define an interface structure. A conductive trace can be disposed in or on the second element. A bond pad can be provided at an upper surface of the first element and in electrical communication with the conductive trace. An integrated device can be coupled to or formed with the first element or the second element.
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