Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cyprian Emeka Uzoh0
Gaius Gillman Fountain, Jr.0
Guilian Gao0
Laura Wills Mirkarimi0
Date of Patent
August 20, 2024
0Patent Application Number
181483690
Date Filed
December 29, 2022
0Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
Representative implementations of techniques and methods include processing singulated dies in preparation for bonding. A plurality of semiconductor die components may be singulated from a wafer component, the semiconductor die components each having a substantially planar surface. Particles and shards of material may be removed from edges of the plurality of semiconductor die component. Additionally, one or more of the plurality of semiconductor die components may be bonded to a prepared bonding surface, via the substantially planar surface.
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