Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 12068278 Processed stacked dies

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 29, 2022
0
Date of Patent
August 20, 2024
0
Patent Application Number
18148369
0
Patent Citations
‌
US Patent 10998292 Offset pads over TSV
0
‌
US Patent 11631647 Integrated device packages with integrated device die and dummy element
0
‌
US Patent 11652083 Processed stacked dies
0
‌
US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
0
‌
US Patent 11749645 TSV as pad
0
‌
US Patent 11762200 Bonded optical devices
0
‌
US Patent 11764177 Bonded structure with interconnect structure
0
‌
US Patent 11842894 Electrical redundancy for bonded structures
0
‌
US Patent 11876076 Apparatus for non-volatile random access memory stacks
0
‌
US Patent 6887769 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
0
•••
Patent Inventor Names
Cyprian Emeka Uzoh
0
Gaius Gillman Fountain, Jr.
0
Guilian Gao
0
Laura Wills Mirkarimi
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
12068278
0
Patent Primary Examiner
‌
Mounir S Amer
0
CPC Code
‌
H01L 24/83
0

Find more entities like US Patent 12068278 Processed stacked dies

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo