Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Belgacem Haba
Date of Patent
September 19, 2023
Patent Application Number
17171531
Date Filed
February 9, 2021
Patent Citations
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Patent Citations Received
0
0
0
Patent Primary Examiner
Patent abstract
A bonded structure is disclosed. The bonded structure can include an interconnect structure. The bonded structure can also include a first die directly bonded to the interconnect structure. The bonded structure can also include a second die mounted to the interconnect structure. The second die is spaced apart from the first die laterally along an upper surface of the interconnect structure. The second die is electrically connected with the first die at least partially through the interconnect structure. The bonded structure can further include a dielectric layer that is disposed over the upper surface of the interconnect structure between the first die and the second die.
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