Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajesh Katkar0
Date of Patent
July 20, 2021
0Patent Application Number
165134890
Date Filed
July 16, 2019
0Patent Citations
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Methods of forming a back side image sensor device, as well as back side image sensor devices formed, are disclosed. In one such a method, an image sensor wafer having a first dielectric layer with a first surface is obtained. A reconstituted wafer having a processor die and a second dielectric layer with a second surface is obtained. The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer. In another method, such formation is for a processor die bonded to an image sensor wafer. In yet another method, such formation is for a processor die bonded to an image sensor die.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.