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US Patent 11764177 Bonded structure with interconnect structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 9, 2021
Date of Patent
September 19, 2023
Patent Application Number
17171531
Patent Citations
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US Patent 10707087 Processing stacked substrates
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US Patent 11056390 Structures and methods for reliable packages
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US Patent 11069734 Image sensor device
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US Patent 11145626 Semiconductor package
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US Patent 11176450 Three dimensional circuit implementing machine trained network
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
•••
Patent Citations Received
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
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US Patent 11990448 Direct bonding in microelectronic assemblies
0
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US Patent 12068278 Processed stacked dies
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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Patent Inventor Names
Belgacem Haba
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11764177
Patent Primary Examiner
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Niki H Nguyen

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