Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Liang Wang0
Cyprian Emeka Uzoh0
Guilian Gao0
Hong Shen0
Arkalgud R. Sitaram0
Date of Patent
July 6, 2021
0Patent Application Number
167188200
Date Filed
December 18, 2019
0Patent Citations
...
Patent Citations Received
0
0
0
...
Patent Primary Examiner
Patent abstract
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.
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