Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gordon M. Grivna0
Jason Michael Doub0
Date of Patent
July 17, 2018
0Patent Application Number
152555030
Date Filed
September 2, 2016
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
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