Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Liang Wang0
Cyprian Emeka Uzoh0
Guilian Gao0
Ilyas Mohammed0
Rajesh Katkar0
Shaowu Huang0
Date of Patent
December 17, 2019
0Patent Application Number
159207590
Date Filed
March 14, 2018
0Patent Citations
Patent Citations Received
0
0
0
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Patent Primary Examiner
Patent abstract
Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
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