Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 24, 2019
Patent Application Number
15919894
Date Filed
March 13, 2018
Patent Citations
Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
A first conductive material having a first hardness is disposed within a recess or opening of a microelectronic component, in a first preselected pattern, and forms a first portion of an interconnect structure. A second conductive material having a second hardness different from the first hardness is disposed within the recess or opening in a second preselected pattern and forms a second portion of the interconnect structure.
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