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US Patent 11515279 Low temperature bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
August 18, 2020
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Date of Patent
November 29, 2022
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Patent Application Number
16995988
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Patent Citations
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10446487 Interface structures and methods for forming same
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US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
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US Patent 10508030 Seal for microelectronic assembly
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US Patent 10515913 Multi-metal contact structure
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US Patent 10522499 Bonded structures
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US Patent 10707087 Processing stacked substrates
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US Patent 10784191 Interface structures and methods for forming same
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US Patent 10790262 Low temperature bonded structures
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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Patent Citations Received
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US Patent 11908739 Flat metal features for microelectronics applications
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US Patent 12132020 Low temperature bonded structures
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US Patent 11894326 Multi-metal contact structure
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Patent Inventor Names
Laura Wills Mirkarimi
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Liang Wang
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Rajesh Katkar
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Cyprian Emeka Uzoh
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Guilian Gao
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Jeremy Alfred Theil
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11515279
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Patent Primary Examiner
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Scott B. Geyer
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CPC Code
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H01L 2224/08112
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H01L 2224/08111
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H01L 2224/32502
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H01L 2224/32111
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H01L 2224/32112
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H01L 2224/32135
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H01L 2224/08502
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