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US Patent 10790262 Low temperature bonded structures

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

September 29, 2020

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Patent Application Number

163638940

Date Filed

March 25, 2019

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Patent Citations

US Patent 10192850 Bonding process with inhibited oxide formation

US Patent 10224286 Interconnect structure with adhesive dielectric layer and methods of forming same

US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer

US Patent 10075657 Edgeless large area camera system

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US Patent 10269756 Die processing

US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die

Patent Citations Received

US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same

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US Patent 11476213 Bonded structures without intervening adhesive

US Patent 11515202 3D IC method and device

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US Patent 11515279 Low temperature bonded structures

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US Patent 11538781 Integrated device packages including bonded structures

US Patent 11552041 Chemical mechanical polishing for hybrid bonding

US Patent 12125784 Interconnect structures

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US Patent 12132020 Low temperature bonded structures

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