Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 16, 2019
Patent Application Number
15829260
Date Filed
December 1, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package may include a first chip stack including first chips which are stacked on a package substrate. The semiconductor package may include a second chip stack including second chips which are stacked on the package substrate. The semiconductor package may include a third chip disposed on the first and second chip stacks.
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