Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jaekyu Sung
Hyungu Kang
Date of Patent
October 17, 2023
Patent Application Number
18099092
Date Filed
January 19, 2023
Patent Citations
...
Patent Primary Examiner
Patent abstract
A semiconductor package may include a semiconductor chip on a package substrate. The semiconductor package may include a plurality of conductive connections connecting the semiconductor chip to the package substrate may be disposed, a plurality of towers which are apart from one another and each include a plurality of memory chips may be disposed, wherein a lowermost memory chip of each of the plurality of towers overlaps the semiconductor chip from a top-down view. The semiconductor package further includes a plurality of adhesive layers be attached between the lowermost memory chip of each of the plurality of towers and the semiconductor chip.
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