Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Norio Takahashi0
Date of Patent
August 18, 2009
Patent Application Number
10842486
Date Filed
May 11, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides a multichip package wherein a plurality of semiconductor chip packages (100) in each of which first electrode pads (16a) provided in a main surface of a semiconductor chip, and first bonding pads (20a) and first central bonding pads (18a) formed in an upper area of the main surface are respectively electrically connected by first redistribution wiring layers (24) in a one-to-one correspondence relationship, and second electrode pads (17b), and second bonding pads (22b) and second central bonding pads (18b) formed in an upper area of the main surface are respectively electrically connected by second redistribution wiring layers (26) in a one-to-one correspondence relationship, are stacked on one another.
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